IONAL AMPLIFIERS SLOS191D - FEBRUARY 1997 - REVISED NOVEMBER 2010 TLE2021 AVAILABLE OPTIONS PACKAGED DEVICES TA VIOmax AT 25C SMALL OUTLINE (D) SSOP (DB) CHIP CARRIER (FK) CERAMIC DIP (JG) PLASTIC DIP (P) TSSOP (PW) CHIP FORM (Y) 0C 0 C to 70C 200 V 500 V TLE2021ACD TLE2021CD TLE2021CDBLE -- -- TLE2021ACP TLE2021CP -- TLE2021CPWLE -- TLE2021Y -40C to 85C 200 V 500 V TLE2021AID TLE2021ID -- -- -- TLE2021AIP TLE2021IP -- -- -55 C -55C to 125C 100 V V 500 V -- TLE2021MD -- TLE2021BMFK TLE2021MFK TLE2021BMJG TLE2021MJG -- TLE2021MP -- -- The D packages are available taped and reeled. To order a taped and reeled part, add the suffix R (e.g., TLE2021CDR). The DB and PW packages are only available left-end taped and reeled. Chip forms are tested at 25C only. TLE2022 AVAILABLE OPTIONS PACKAGED DEVICES CHIP CARRIER (FK) CERAMIC DIP (JG) PLASTIC DIP (P) TSSOP (PW) CHIP FORM (Y) -- TLE2022CDBLE -- -- -- TLE2022ACP TLE2022CP -- -- TLE2022CPWLE -- -- TLE2022Y TLE2022BID TLE2022AID TLE2022ID -- -- -- -- TLE202
IONAL AMPLIFIERS SLOS191D - FEBRUARY 1997 - REVISED NOVEMBER 2010 TLE2021 AVAILABLE OPTIONS PACKAGED DEVICES TA VIOmax AT 25C SMALL OUTLINE (D) SSOP (DB) CHIP CARRIER (FK) CERAMIC DIP (JG) PLASTIC DIP (P) TSSOP (PW) CHIP FORM (Y) 0C 0 C to 70C 200 V 500 V TLE2021ACD TLE2021CD TLE2021CDBLE -- -- TLE2021ACP TLE2021CP -- TLE2021CPWLE -- TLE2021Y -40C to 85C 200 V 500 V TLE2021AID TLE2021ID -- -- -- TLE2021AIP TLE2021IP -- -- -55 C -55C to 125C 100 V V 500 V -- TLE2021MD -- TLE2021BMFK TLE2021MFK TLE2021BMJG TLE2021MJG -- TLE2021MP -- -- The D packages are available taped and reeled. To order a taped and reeled part, add the suffix R (e.g., TLE2021CDR). The DB and PW packages are only available left-end taped and reeled. Chip forms are tested at 25C only. TLE2022 AVAILABLE OPTIONS PACKAGED DEVICES CHIP CARRIER (FK) CERAMIC DIP (JG) PLASTIC DIP (P) TSSOP (PW) CHIP FORM (Y) -- TLE2022CDBLE -- -- -- TLE2022ACP TLE2022CP -- -- TLE2022CPWLE -- -- TLE2022Y TLE2022BID TLE2022AID TLE2022ID -- -- -- -- TLE202
IONAL AMPLIFIERS SLOS191D - FEBRUARY 1997 - REVISED NOVEMBER 2010 TLE2021 AVAILABLE OPTIONS PACKAGED DEVICES TA VIOmax AT 25C SMALL OUTLINE (D) SSOP (DB) CHIP CARRIER (FK) CERAMIC DIP (JG) PLASTIC DIP (P) TSSOP (PW) CHIP FORM (Y) 0C 0 C to 70C 200 V 500 V TLE2021ACD TLE2021CD TLE2021CDBLE -- -- TLE2021ACP TLE2021CP -- TLE2021CPWLE -- TLE2021Y -40C to 85C 200 V 500 V TLE2021AID TLE2021ID -- -- -- TLE2021AIP TLE2021IP -- -- -55 C -55C to 125C 100 V V 500 V -- TLE2021MD -- TLE2021BMFK TLE2021MFK TLE2021BMJG TLE2021MJG -- TLE2021MP -- -- The D packages are available taped and reeled. To order a taped and reeled part, add the suffix R (e.g., TLE2021CDR). The DB and PW packages are only available left-end taped and reeled. Chip forms are tested at 25C only. TLE2022 AVAILABLE OPTIONS PACKAGED DEVICES CHIP CARRIER (FK) CERAMIC DIP (JG) PLASTIC DIP (P) TSSOP (PW) CHIP FORM (Y) -- TLE2022CDBLE -- -- -- TLE2022ACP TLE2022CP -- -- TLE2022CPWLE -- -- TLE2022Y TLE2022BID TLE2022AID TLE2022ID -- -- -- -- TLE202
IONAL AMPLIFIERS SLOS191D - FEBRUARY 1997 - REVISED NOVEMBER 2010 TLE2021 AVAILABLE OPTIONS PACKAGED DEVICES TA VIOmax AT 25C SMALL OUTLINE (D) SSOP (DB) CHIP CARRIER (FK) CERAMIC DIP (JG) PLASTIC DIP (P) TSSOP (PW) CHIP FORM (Y) 0C 0 C to 70C 200 V 500 V TLE2021ACD TLE2021CD TLE2021CDBLE -- -- TLE2021ACP TLE2021CP -- TLE2021CPWLE -- TLE2021Y -40C to 85C 200 V 500 V TLE2021AID TLE2021ID -- -- -- TLE2021AIP TLE2021IP -- -- -55 C -55C to 125C 100 V V 500 V -- TLE2021MD -- TLE2021BMFK TLE2021MFK TLE2021BMJG TLE2021MJG -- TLE2021MP -- -- The D packages are available taped and reeled. To order a taped and reeled part, add the suffix R (e.g., TLE2021CDR). The DB and PW packages are only available left-end taped and reeled. Chip forms are tested at 25C only. TLE2022 AVAILABLE OPTIONS PACKAGED DEVICES CHIP CARRIER (FK) CERAMIC DIP (JG) PLASTIC DIP (P) TSSOP (PW) CHIP FORM (Y) -- TLE2022CDBLE -- -- -- TLE2022ACP TLE2022CP -- -- TLE2022CPWLE -- -- TLE2022Y TLE2022BID TLE2022AID TLE2022ID -- -- -- -- TLE202
LLAS, TEXAS 75265 1 SLOS191C - FEBRUARY 1997 - REVISED APRIL 2007 TLE2021 AVAILABLE OPTIONS PACKAGED DEVICES TA VIOmax AT 25C SMALL OUTLINE (D) SSOP (DB) CHIP CARRIER (FK) CERAMIC DIP (JG) PLASTIC DIP (P) TSSOP (PW) CHIP FORM (Y) 0C 0 C to 70C 200 V 500 V TLE2021ACD TLE2021CD TLE2021CDBLE -- -- TLE2021ACP TLE2021CP -- TLE2021CPWLE -- TLE2021Y -40C to 85C 200 V 500 V TLE2021AID TLE2021ID -- -- -- TLE2021AIP TLE2021IP -- -- -55 C -55C to 125C 100 V 200 V 500 V -- TLE2021AMD TLE2021MD -- TLE2021BMFK TLE2021AMFK TLE2021MFK TLE2021BMJG TLE2021AMJG TLE2021MJG -- TLE2021AMP TLE2021MP -- -- The D packages are available taped and reeled. To order a taped and reeled part, add the suffix R (e.g., TLE2021CDR). The DB and PW packages are only available left-end taped and reeled. Chip forms are tested at 25C only. TLE2022 AVAILABLE OPTIONS PACKAGED DEVICES CHIP CARRIER (FK) CERAMIC DIP (JG) PLASTIC DIP (P) TSSOP (PW) CHIP FORM (Y) -- TLE2022CDBLE -- -- -- TLE2022ACP TLE2022CP -- -- TLE2022CPWLE -- -- TLE2022Y
LLAS, TEXAS 75265 1 SLOS191C - FEBRUARY 1997 - REVISED APRIL 2007 TLE2021 AVAILABLE OPTIONS PACKAGED DEVICES TA VIOmax AT 25C SMALL OUTLINE (D) SSOP (DB) CHIP CARRIER (FK) CERAMIC DIP (JG) PLASTIC DIP (P) TSSOP (PW) CHIP FORM (Y) 0C 0 C to 70C 200 V 500 V TLE2021ACD TLE2021CD TLE2021CDBLE -- -- TLE2021ACP TLE2021CP -- TLE2021CPWLE -- TLE2021Y -40C to 85C 200 V 500 V TLE2021AID TLE2021ID -- -- -- TLE2021AIP TLE2021IP -- -- -55 C -55C to 125C 100 V 200 V 500 V -- TLE2021AMD TLE2021MD -- TLE2021BMFK TLE2021AMFK TLE2021MFK TLE2021BMJG TLE2021AMJG TLE2021MJG -- TLE2021AMP TLE2021MP -- -- The D packages are available taped and reeled. To order a taped and reeled part, add the suffix R (e.g., TLE2021CDR). The DB and PW packages are only available left-end taped and reeled. Chip forms are tested at 25C only. TLE2022 AVAILABLE OPTIONS PACKAGED DEVICES CHIP CARRIER (FK) CERAMIC DIP (JG) PLASTIC DIP (P) TSSOP (PW) CHIP FORM (Y) -- TLE2022CDBLE -- -- -- TLE2022ACP TLE2022CP -- -- TLE2022CPWLE -- -- TLE2022Y
IONAL AMPLIFIERS SLOS191D - FEBRUARY 1997 - REVISED NOVEMBER 2010 TLE2021 AVAILABLE OPTIONS PACKAGED DEVICES TA VIOmax AT 25C SMALL OUTLINE (D) SSOP (DB) CHIP CARRIER (FK) CERAMIC DIP (JG) PLASTIC DIP (P) TSSOP (PW) CHIP FORM (Y) 0C 0 C to 70C 200 V 500 V TLE2021ACD TLE2021CD TLE2021CDBLE -- -- TLE2021ACP TLE2021CP -- TLE2021CPWLE -- TLE2021Y -40C to 85C 200 V 500 V TLE2021AID TLE2021ID -- -- -- TLE2021AIP TLE2021IP -- -- -55 C -55C to 125C 100 V V 500 V -- TLE2021MD -- TLE2021BMFK TLE2021MFK TLE2021BMJG TLE2021MJG -- TLE2021MP -- -- The D packages are available taped and reeled. To order a taped and reeled part, add the suffix R (e.g., TLE2021CDR). The DB and PW packages are only available left-end taped and reeled. Chip forms are tested at 25C only. TLE2022 AVAILABLE OPTIONS PACKAGED DEVICES CHIP CARRIER (FK) CERAMIC DIP (JG) PLASTIC DIP (P) TSSOP (PW) CHIP FORM (Y) -- TLE2022CDBLE -- -- -- TLE2022ACP TLE2022CP -- -- TLE2022CPWLE -- -- TLE2022Y TLE2022BID TLE2022AID TLE2022ID -- -- -- -- TLE202
IONAL AMPLIFIERS SLOS191D - FEBRUARY 1997 - REVISED NOVEMBER 2010 TLE2021 AVAILABLE OPTIONS PACKAGED DEVICES TA VIOmax AT 25C SMALL OUTLINE (D) SSOP (DB) CHIP CARRIER (FK) CERAMIC DIP (JG) PLASTIC DIP (P) TSSOP (PW) CHIP FORM (Y) 0C 0 C to 70C 200 V 500 V TLE2021ACD TLE2021CD TLE2021CDBLE -- -- TLE2021ACP TLE2021CP -- TLE2021CPWLE -- TLE2021Y -40C to 85C 200 V 500 V TLE2021AID TLE2021ID -- -- -- TLE2021AIP TLE2021IP -- -- -55 C -55C to 125C 100 V V 500 V -- TLE2021MD -- TLE2021BMFK TLE2021MFK TLE2021BMJG TLE2021MJG -- TLE2021MP -- -- The D packages are available taped and reeled. To order a taped and reeled part, add the suffix R (e.g., TLE2021CDR). The DB and PW packages are only available left-end taped and reeled. Chip forms are tested at 25C only. TLE2022 AVAILABLE OPTIONS PACKAGED DEVICES CHIP CARRIER (FK) CERAMIC DIP (JG) PLASTIC DIP (P) TSSOP (PW) CHIP FORM (Y) -- TLE2022CDBLE -- -- -- TLE2022ACP TLE2022CP -- -- TLE2022CPWLE -- -- TLE2022Y TLE2022BID TLE2022AID TLE2022ID -- -- -- -- TLE202
LLAS, TEXAS 75265 1 SLOS191C - FEBRUARY 1997 - REVISED APRIL 2007 TLE2021 AVAILABLE OPTIONS PACKAGED DEVICES TA VIOmax AT 25C SMALL OUTLINE (D) SSOP (DB) CHIP CARRIER (FK) CERAMIC DIP (JG) PLASTIC DIP (P) TSSOP (PW) CHIP FORM (Y) 0C 0 C to 70C 200 V 500 V TLE2021ACD TLE2021CD TLE2021CDBLE -- -- TLE2021ACP TLE2021CP -- TLE2021CPWLE -- TLE2021Y -40C to 85C 200 V 500 V TLE2021AID TLE2021ID -- -- -- TLE2021AIP TLE2021IP -- -- -55 C -55C to 125C 100 V 200 V 500 V -- TLE2021AMD TLE2021MD -- TLE2021BMFK TLE2021AMFK TLE2021MFK TLE2021BMJG TLE2021AMJG TLE2021MJG -- TLE2021AMP TLE2021MP -- -- The D packages are available taped and reeled. To order a taped and reeled part, add the suffix R (e.g., TLE2021CDR). The DB and PW packages are only available left-end taped and reeled. Chip forms are tested at 25C only. TLE2022 AVAILABLE OPTIONS PACKAGED DEVICES CHIP CARRIER (FK) CERAMIC DIP (JG) PLASTIC DIP (P) TSSOP (PW) CHIP FORM (Y) -- TLE2022CDBLE -- -- -- TLE2022ACP TLE2022CP -- -- TLE2022CPWLE -- -- TLE2022Y
IONAL AMPLIFIERS SLOS191D - FEBRUARY 1997 - REVISED NOVEMBER 2010 TLE2021 AVAILABLE OPTIONS PACKAGED DEVICES TA VIOmax AT 25C SMALL OUTLINE (D) SSOP (DB) CHIP CARRIER (FK) CERAMIC DIP (JG) PLASTIC DIP (P) TSSOP (PW) CHIP FORM (Y) 0C 0 C to 70C 200 V 500 V TLE2021ACD TLE2021CD TLE2021CDBLE -- -- TLE2021ACP TLE2021CP -- TLE2021CPWLE -- TLE2021Y -40C to 85C 200 V 500 V TLE2021AID TLE2021ID -- -- -- TLE2021AIP TLE2021IP -- -- -55 C -55C to 125C 100 V V 500 V -- TLE2021MD -- TLE2021BMFK TLE2021MFK TLE2021BMJG TLE2021MJG -- TLE2021MP -- -- The D packages are available taped and reeled. To order a taped and reeled part, add the suffix R (e.g., TLE2021CDR). The DB and PW packages are only available left-end taped and reeled. Chip forms are tested at 25C only. TLE2022 AVAILABLE OPTIONS PACKAGED DEVICES CHIP CARRIER (FK) CERAMIC DIP (JG) PLASTIC DIP (P) TSSOP (PW) CHIP FORM (Y) -- TLE2022CDBLE -- -- -- TLE2022ACP TLE2022CP -- -- TLE2022CPWLE -- -- TLE2022Y TLE2022BID TLE2022AID TLE2022ID -- -- -- -- TLE202
IONAL AMPLIFIERS SLOS191D - FEBRUARY 1997 - REVISED NOVEMBER 2010 TLE2021 AVAILABLE OPTIONS PACKAGED DEVICES TA VIOmax AT 25C SMALL OUTLINE (D) SSOP (DB) CHIP CARRIER (FK) CERAMIC DIP (JG) PLASTIC DIP (P) TSSOP (PW) CHIP FORM (Y) 0C 0 C to 70C 200 V 500 V TLE2021ACD TLE2021CD TLE2021CDBLE -- -- TLE2021ACP TLE2021CP -- TLE2021CPWLE -- TLE2021Y -40C to 85C 200 V 500 V TLE2021AID TLE2021ID -- -- -- TLE2021AIP TLE2021IP -- -- -55 C -55C to 125C 100 V V 500 V -- TLE2021MD -- TLE2021BMFK TLE2021MFK TLE2021BMJG TLE2021MJG -- TLE2021MP -- -- The D packages are available taped and reeled. To order a taped and reeled part, add the suffix R (e.g., TLE2021CDR). The DB and PW packages are only available left-end taped and reeled. Chip forms are tested at 25C only. TLE2022 AVAILABLE OPTIONS PACKAGED DEVICES CHIP CARRIER (FK) CERAMIC DIP (JG) PLASTIC DIP (P) TSSOP (PW) CHIP FORM (Y) -- TLE2022CDBLE -- -- -- TLE2022ACP TLE2022CP -- -- TLE2022CPWLE -- -- TLE2022Y TLE2022BID TLE2022AID TLE2022ID -- -- -- -- TLE202
IONAL AMPLIFIERS SLOS191D - FEBRUARY 1997 - REVISED NOVEMBER 2010 TLE2021 AVAILABLE OPTIONS PACKAGED DEVICES TA VIOmax AT 25C SMALL OUTLINE (D) SSOP (DB) CHIP CARRIER (FK) CERAMIC DIP (JG) PLASTIC DIP (P) TSSOP (PW) CHIP FORM (Y) 0C 0 C to 70C 200 V 500 V TLE2021ACD TLE2021CD TLE2021CDBLE -- -- TLE2021ACP TLE2021CP -- TLE2021CPWLE -- TLE2021Y -40C to 85C 200 V 500 V TLE2021AID TLE2021ID -- -- -- TLE2021AIP TLE2021IP -- -- -55 C -55C to 125C 100 V V 500 V -- TLE2021MD -- TLE2021BMFK TLE2021MFK TLE2021BMJG TLE2021MJG -- TLE2021MP -- -- The D packages are available taped and reeled. To order a taped and reeled part, add the suffix R (e.g., TLE2021CDR). The DB and PW packages are only available left-end taped and reeled. Chip forms are tested at 25C only. TLE2022 AVAILABLE OPTIONS PACKAGED DEVICES CHIP CARRIER (FK) CERAMIC DIP (JG) PLASTIC DIP (P) TSSOP (PW) CHIP FORM (Y) -- TLE2022CDBLE -- -- -- TLE2022ACP TLE2022CP -- -- TLE2022CPWLE -- -- TLE2022Y TLE2022BID TLE2022AID TLE2022ID -- -- -- -- TLE202
IONAL AMPLIFIERS SLOS191D - FEBRUARY 1997 - REVISED NOVEMBER 2010 TLE2021 AVAILABLE OPTIONS PACKAGED DEVICES TA VIOmax AT 25C SMALL OUTLINE (D) SSOP (DB) CHIP CARRIER (FK) CERAMIC DIP (JG) PLASTIC DIP (P) TSSOP (PW) CHIP FORM (Y) 0C 0 C to 70C 200 V 500 V TLE2021ACD TLE2021CD TLE2021CDBLE -- -- TLE2021ACP TLE2021CP -- TLE2021CPWLE -- TLE2021Y -40C to 85C 200 V 500 V TLE2021AID TLE2021ID -- -- -- TLE2021AIP TLE2021IP -- -- -55 C -55C to 125C 100 V V 500 V -- TLE2021MD -- TLE2021BMFK TLE2021MFK TLE2021BMJG TLE2021MJG -- TLE2021MP -- -- The D packages are available taped and reeled. To order a taped and reeled part, add the suffix R (e.g., TLE2021CDR). The DB and PW packages are only available left-end taped and reeled. Chip forms are tested at 25C only. TLE2022 AVAILABLE OPTIONS PACKAGED DEVICES CHIP CARRIER (FK) CERAMIC DIP (JG) PLASTIC DIP (P) TSSOP (PW) CHIP FORM (Y) -- TLE2022CDBLE -- -- -- TLE2022ACP TLE2022CP -- -- TLE2022CPWLE -- -- TLE2022Y TLE2022BID TLE2022AID TLE2022ID -- -- -- -- TLE202
IONAL AMPLIFIERS SLOS191D - FEBRUARY 1997 - REVISED NOVEMBER 2010 TLE2021 AVAILABLE OPTIONS PACKAGED DEVICES TA VIOmax AT 25C SMALL OUTLINE (D) SSOP (DB) CHIP CARRIER (FK) CERAMIC DIP (JG) PLASTIC DIP (P) TSSOP (PW) CHIP FORM (Y) 0C 0 C to 70C 200 V 500 V TLE2021ACD TLE2021CD TLE2021CDBLE -- -- TLE2021ACP TLE2021CP -- TLE2021CPWLE -- TLE2021Y -40C to 85C 200 V 500 V TLE2021AID TLE2021ID -- -- -- TLE2021AIP TLE2021IP -- -- -55 C -55C to 125C 100 V V 500 V -- TLE2021MD -- TLE2021BMFK TLE2021MFK TLE2021BMJG TLE2021MJG -- TLE2021MP -- -- The D packages are available taped and reeled. To order a taped and reeled part, add the suffix R (e.g., TLE2021CDR). The DB and PW packages are only available left-end taped and reeled. Chip forms are tested at 25C only. TLE2022 AVAILABLE OPTIONS PACKAGED DEVICES CHIP CARRIER (FK) CERAMIC DIP (JG) PLASTIC DIP (P) TSSOP (PW) CHIP FORM (Y) -- TLE2022CDBLE -- -- -- TLE2022ACP TLE2022CP -- -- TLE2022CPWLE -- -- TLE2022Y TLE2022BID TLE2022AID TLE2022ID -- -- -- -- TLE202
IONAL AMPLIFIERS SLOS191D - FEBRUARY 1997 - REVISED NOVEMBER 2010 TLE2021 AVAILABLE OPTIONS PACKAGED DEVICES TA VIOmax AT 25C SMALL OUTLINE (D) SSOP (DB) CHIP CARRIER (FK) CERAMIC DIP (JG) PLASTIC DIP (P) TSSOP (PW) CHIP FORM (Y) 0C 0 C to 70C 200 V 500 V TLE2021ACD TLE2021CD TLE2021CDBLE -- -- TLE2021ACP TLE2021CP -- TLE2021CPWLE -- TLE2021Y -40C to 85C 200 V 500 V TLE2021AID TLE2021ID -- -- -- TLE2021AIP TLE2021IP -- -- -55 C -55C to 125C 100 V V 500 V -- TLE2021MD -- TLE2021BMFK TLE2021MFK TLE2021BMJG TLE2021MJG -- TLE2021MP -- -- The D packages are available taped and reeled. To order a taped and reeled part, add the suffix R (e.g., TLE2021CDR). The DB and PW packages are only available left-end taped and reeled. Chip forms are tested at 25C only. TLE2022 AVAILABLE OPTIONS PACKAGED DEVICES CHIP CARRIER (FK) CERAMIC DIP (JG) PLASTIC DIP (P) TSSOP (PW) CHIP FORM (Y) -- TLE2022CDBLE -- -- -- TLE2022ACP TLE2022CP -- -- TLE2022CPWLE -- -- TLE2022Y TLE2022BID TLE2022AID TLE2022ID -- -- -- -- TLE202