EGF1A, EGF1B, EGF1C, EGF1D www.vishay.com Vishay General Semiconductor Surface Mount Glass Passivated Ultrafast Rectifier FEATURES * Superectifier structure for high reliability condition * Cavity-free glass-passivated junction Superectifier(R) * Ideal for automated placement * Ultrafast reverse recovery time * Low switching losses, high efficiency * High forward surge capability * Meets MSL level 1, per J-STD-020, LF maximum peak of 250 C GF1 (DO-214BA) * AEC-Q101 qualified - Automotive ordering code: base P/NHE3 * Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 PRIMARY CHARACTERISTICS IF(AV) 1.0 A VRRM 50 V, 100 V, 150 V, 200 V IFSM 30 A trr 50 ns VF 1.0 V TJ max. 175 C Package GF1 (DO-214BA) Diode variations Single TYPICAL APPLICATIONS For use in high frequency rectification and freewheeling application in switching mode converters and inverters for consumer, computer, automotive and telecommunication. MECHANICAL DATA Case: GF1 (DO-214BA), molded epox
EGF1A, EGF1B, EGF1C, EGF1D www.vishay.com Vishay General Semiconductor Surface Mount Glass Passivated Ultrafast Rectifier FEATURES * Superectifier structure for high reliability condition * Cavity-free glass-passivated junction Superectifier(R) * Ideal for automated placement * Ultrafast reverse recovery time * Low switching losses, high efficiency * High forward surge capability * Meets MSL level 1, per J-STD-020, LF maximum peak of 250 C GF1 (DO-214BA) * AEC-Q101 qualified - Automotive ordering code: base P/NHE3 * Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 PRIMARY CHARACTERISTICS IF(AV) 1.0 A VRRM 50 V, 100 V, 150 V, 200 V IFSM 30 A trr 50 ns VF 1.0 V TJ max. 175 C Package GF1 (DO-214BA) Diode variations Single TYPICAL APPLICATIONS For use in high frequency rectification and freewheeling application in switching mode converters and inverters for consumer, computer, automotive and telecommunication. MECHANICAL DATA Case: GF1 (DO-214BA), molded epox
EGF1A - EGF1K 1.0A Sintered Glass Passivated Super Fast Rectifier Features * * * * * * Sintered glass passivated (SGP) rectifier chip Glass passivated cavity-free junction Ideal for surface mount automotive applications Built-in strain relief Easy pick and place High temperature soldering guaranteed:260C/10 seconds, at terminals * RoHS Compliance SMA Mechanical Data Case: JEDEC DO-214AC(SMA) molded plastic over passivated chip Epoxy: Plastic package has UL flammability classification 94V-0 Terminals: Solder plated, solderable per MIL-STD-750, Method 2026 Polarity: Color band denotes cathode end Weight: 0.002 ounces, 0.064 gram Maximum Ratings and Electrical Characteristics (T A=25C unless noted otherwise) Symbol Description EGF1A EGF1B EGF1D EGF1G EGF1J EGF1K Unit VRRM Maximum Repetitive Peak Reverse Voltage 50 100 200 400 600 800 V VRMS Maximum RMS Voltage 35 70 140 280 420 560 V Maximum DC Blocking Voltage 50 100 200 400 600 800 V VDC IF(AV) IFSM Maximum Average Forward Rectified C
EGF1A - EGF1D EGF1A - EGF1D Features * * * Low forward voltage drop. Low profile package. Fast switching for high efficiency. SMA/DO-214AC COLOR BAND DENOTES CATHODE Fast Rectifiers (Glass Passivated) Absolute Maximum Ratings* Symbol TA = 25C unless otherwise noted Parameter VRRM Maximum Repetitive Reverse Voltage IF(AV) Average Rectified Forward Current, @ TL = 100C IFSM Non-repetitive Peak Forward Surge Current 8.3 ms Single Half-Sine-Wave Storage Temperature Range Operating Junction Temperature Tstg TJ Value 1A 50 1B 100 1C 150 1D 200 Units V 1.0 A 30 A -65 to +175 C -65 to +175 C *These ratings are limiting values above which the serviceability of any semiconductor device may be impaired. Thermal Characteristics Symbol Parameter Value Units PD Power Dissipation 2.0 W RJA Thermal Resistance, Junction to Ambient* 85 C/W RJL Thermal Resistance, Junction to Lead* 30 C/W *Device mounted on FR-4 PCB 0.013 mm. Electrical Characteristics Symbol TA = 25C unless otherwise noted Device Para
EGF1A thru EGF1D Vishay General Semiconductor Surface Mount Glass Passivated Ultrafast Rectifier FEATURES * Superectifier structure for high reliability condition * Cavity-free glass-passivated junction SUPERECTIFIER(R) * Ideal for automated placement * Ultrafast reverse recovery time * Low switching losses, high efficiency * High forward surge capability * Meets environmental standard MIL-S-19500 * Meets MSL level 1, per J-STD-020, LF maximum peak of 250 C DO-214BA (GF1) * AEC-Q101 qualified * Compliant to RoHS Directive 2002/95/EC and in accordance to WEEE 2002/96/EC TYPICAL APPLICATIONS For use in high frequency rectification and freewheeling application in switching mode converters and inverters for consumer, computer, automotive and telecommunication. PRIMARY CHARACTERISTICS IF(AV) 1.0 A VRRM 50 V to 200 V IFSM 30 A trr 50 ns VF 1.0 V TJ max. 175 C MECHANICAL DATA Case: DO-214BA, molded epoxy over glass body Molding compound meets UL 94 V-0 flammability rating Base P/N-E3 - RoHS compliant, c
EGF1A thru EGF1D Vishay General Semiconductor Surface Mount Glass Passivated Ultrafast Rectifier (R) Major Ratings and Characteristics IF(AV) 1.0 A VRRM 50 V to 200 V IFSM 30 A trr 50 ns VF 1.0 V Tj max. 175 C d* e t n Pate * Glass-plastic encapsulation technique is covered by patent No. 3,996,602, brazed-lead assembly by Patent No. 3,930,306 and lead forming by Patent No. 5,151,846 DO-214BA (GF1) Features Mechanical Data * * * * * * * * Case: DO-214BA, molded epoxy over glass body Epoxy meets UL-94V-0 Flammability rating Terminals: Matte tin plated leads, solderable per J-STD-002B and JESD22-B102D E3 suffix for commercial grade, HE3 suffix for high reliability grade (AEC Q101 qualified) Polarity: Color band denotes cathode end Cavity-free glass-passivated junction Ideal for automated placement Ultrafast reverse recovery time Low switching losses, high efficiency High forward surge capability Meets environmental standard MIL-S-19500 Meets MSL level 1, per J-STD-020C Solder Dip 260 C, 40 seconds T
EGF1A thru EGF1D Vishay General Semiconductor Surface Mount Glass Passivated Ultrafast Rectifier FEATURES * Superectifier structure for high reliability condition * Cavity-free glass-passivated junction * Ideal for automated placement * Ultrafast reverse recovery time * Low switching losses, high efficiency * High forward surge capability * Meets environmental standard MIL-S-19500 * Meets MSL level 1, per J-STD-020, LF maximum peak of 250 C DO-214BA (GF1) * AEC-Q101 qualified * Compliant to RoHS Directive 2002/95/EC and in accordance to WEEE 2002/96/EC TYPICAL APPLICATIONS For use in high frequency rectification and freewheeling application in switching mode converters and inverters for consumer, computer, automotive and telecommunication. PRIMARY CHARACTERISTICS IF(AV) 1.0 A VRRM 50 V to 200 V IFSM 30 A trr 50 ns VF 1.0 V TJ max. 175 C MECHANICAL DATA Case: DO-214BA, molded epoxy over glass body Molding compound meets UL 94 V-0 flammability rating Base P/N-E3 - RoHS compliant, commercial grade B
EGF1A thru EGF1D Vishay General Semiconductor Surface Mount Glass Passivated Ultrafast Rectifier FEATURES * Superectifier structure for high reliability condition * Cavity-free glass-passivated junction SUPERECTIFIER(R) * Ideal for automated placement * Ultrafast reverse recovery time * Low switching losses, high efficiency * High forward surge capability * Meets environmental standard MIL-S-19500 * Meets MSL level 1, per J-STD-020, LF maximum peak of 250 C DO-214BA (GF1) * AEC-Q101 qualified * Compliant to RoHS Directive 2002/95/EC and in accordance to WEEE 2002/96/EC TYPICAL APPLICATIONS For use in high frequency rectification and freewheeling application in switching mode converters and inverters for consumer, computer, automotive and telecommunication. PRIMARY CHARACTERISTICS IF(AV) 1.0 A VRRM 50 V to 200 V IFSM 30 A trr 50 ns VF 1.0 V TJ max. 175 C MECHANICAL DATA Case: DO-214BA, molded epoxy over glass body Molding compound meets UL 94 V-0 flammability rating Base P/N-E3 - RoHS compliant, c
EGF1A thru EGF1D Vishay General Semiconductor Surface Mount Glass Passivated Ultrafast Rectifier (R) FEATURES * Cavity-free glass-passivated junction * Ideal for automated placement * Ultrafast reverse recovery time * Low switching losses, high efficiency * High forward surge capability ed* t n e Pat * Meets environmental standard MIL-S-19500 * Meets MSL level 1, per J-STD-020C, LF max peak of 250 C * Glass-plastic encapsulation technique is covered by patent No. 3,996,602, brazed-lead assembly by Patent No. 3,930,306 and lead forming by Patent No. 5,151,846 DO-214BA (GF1) * Solder Dip 260 C, 40 seconds * Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC MAJOR RATINGS AND CHARACTERISTICS IF(AV) 1.0 A VRRM 50 V to 200 V IFSM 30 A trr 50 ns VF 1.0 V Tj max. 175 C TYPICAL APPLICATIONS For use in high frequency rectification and freewheeling application in switching mode converters and inverters for consumer, computer, automotive and telecommunication. MECHANICAL DATA Case: DO-214BA, mol
EGF1A thru EGF1D Vishay General Semiconductor Surface Mount Glass Passivated Ultrafast Rectifier FEATURES * Cavity-free glass-passivated junction (R) * Ideal for automated placement * Ultrafast reverse recovery time * Low switching losses, high efficiency * High forward surge capability d* e t n e Pat * Meets environmental standard MIL-S-19500 * Meets MSL level 1, per J-STD-020, LF maximum peak of 250 C * Glass-plastic encapsulation technique is covered by patent No. 3,996,602, brazed-lead assembly by Patent No. 3,930,306 and lead forming by Patent No. 5,151,846 DO-214BA (GF1) * Solder dip 260 C, 40 s * Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC PRIMARY CHARACTERISTICS IF(AV) 1.0 A VRRM 50 V to 200 V IFSM 30 A trr 50 ns VF 1.0 V TJ max. 175 C TYPICAL APPLICATIONS For use in high frequency rectification and freewheeling application in switching mode converters and inverters for consumer, computer, automotive and telecommunication. MECHANICAL DATA Case: DO-214BA, molded epoxy ov
EGF1A, EGF1B, EGF1C, EGF1D www.vishay.com Vishay General Semiconductor Surface Mount Glass Passivated Ultrafast Rectifier FEATURES * Superectifier structure for high reliability condition * Cavity-free glass-passivated junction SUPERECTIFIER(R) * Ideal for automated placement * Ultrafast reverse recovery time * Low switching losses, high efficiency * High forward surge capability * Meets MSL level 1, per J-STD-020, LF maximum peak of 250 C DO-214BA (GF1) * AEC-Q101 qualified * Material categorization: For definitions of compliance please see www.vishay.com/doc?99912 TYPICAL APPLICATIONS For use in high frequency rectification and freewheeling application in switching mode converters and inverters for consumer, computer, automotive and telecommunication. PRIMARY CHARACTERISTICS IF(AV) 1.0 A VRRM 50 V, 100 V, 150 V, 200 V IFSM 30 A MECHANICAL DATA trr 50 ns VF 1.0 V TJ max. 175 C Package DO-214BA (GF1) Case: DO-214BA, molded epoxy over glass body Molding compound meets UL 94 V-0 flammability rating
EGF1A thru EGF1D Vishay General Semiconductor Surface Mount Glass Passivated Ultrafast Rectifier FEATURES * Cavity-free glass-passivated junction (R) * Ideal for automated placement * Ultrafast reverse recovery time * Low switching losses, high efficiency * High forward surge capability d* e t n e Pat * Meets environmental standard MIL-S-19500 * Meets MSL level 1, per J-STD-020, LF maximum peak of 250 C * Glass-plastic encapsulation technique is covered by patent No. 3,996,602, brazed-lead assembly by Patent No. 3,930,306 and lead forming by Patent No. 5,151,846 DO-214BA (GF1) * Solder dip 260 C, 40 s * Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC PRIMARY CHARACTERISTICS IF(AV) 1.0 A VRRM 50 V to 200 V IFSM 30 A trr 50 ns VF 1.0 V TJ max. 175 C TYPICAL APPLICATIONS For use in high frequency rectification and freewheeling application in switching mode converters and inverters for consumer, computer, automotive and telecommunication. MECHANICAL DATA Case: DO-214BA, molded epoxy ov
EGF1A, EGF1B, EGF1C, EGF1D www.vishay.com Vishay General Semiconductor Surface Mount Glass Passivated Ultrafast Rectifier FEATURES * Superectifier structure for high reliability condition * Cavity-free glass-passivated junction Superectifier(R) * Ideal for automated placement * Ultrafast reverse recovery time * Low switching losses, high efficiency * High forward surge capability * Meets MSL level 1, per J-STD-020, LF maximum peak of 250 C GF1 (DO-214BA) * AEC-Q101 qualified - Automotive ordering code: base P/NHE3 * Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 PRIMARY CHARACTERISTICS IF(AV) 1.0 A VRRM 50 V, 100 V, 150 V, 200 V IFSM 30 A trr 50 ns VF 1.0 V TJ max. 175 C Package GF1 (DO-214BA) Diode variations Single TYPICAL APPLICATIONS For use in high frequency rectification and freewheeling application in switching mode converters and inverters for consumer, computer, automotive and telecommunication. MECHANICAL DATA Case: GF1 (DO-214BA), molded epox
....................................... DTV56F ........................................................................ EDF1AM thru EDF1DM................................................ EDF1AS thru EDF1DS ................................................. EGF1A thru EGF1D ..................................................... EGF1T.......................................................................... EGL34A thru EGL34G.................................................. EGL41A thru EGL41G.................................................. EGP10A thru EGP10G................................................. EGP20A thru EGP20G................................................. EGP30A thru EGP30G................................................. EGP50A thru EGP50G................................................. ES1A thru ES1D........................................................... ES1PB, ES1PC & ES1PD............................................ ES2A thru ES2D.........................................
EGF1A thru EGF1D Vishay General Semiconductor Surface Mount Glass Passivated Ultrafast Rectifier (R) Major Ratings and Characteristics IF(AV) 1.0 A VRRM 50 V to 200 V IFSM 30 A trr 50 ns VF 1.0 V Tj max. 175 C d* e t n Pate * Glass-plastic encapsulation technique is covered by patent No. 3,996,602, brazed-lead assembly by Patent No. 3,930,306 and lead forming by Patent No. 5,151,846 DO-214BA (GF1) Features Mechanical Data * * * * * * * * Case: DO-214BA, molded epoxy over glass body Epoxy meets UL-94V-0 Flammability rating Terminals: Matte tin plated leads, solderable per J-STD-002B and JESD22-B102D E3 suffix for commercial grade, HE3 suffix for high reliability grade (AEC Q101 qualified) Polarity: Color band denotes cathode end Cavity-free glass-passivated junction Ideal for automated placement Ultrafast reverse recovery time Low switching losses, high efficiency High forward surge capability Meets environmental standard MIL-S-19500 Meets MSL level 1, per J-STD-020C Solder Dip 260 C, 40 seconds T