6242-E/SN MCP6271-E/P MCP6271-E/SN MCP6272-E/P MCP6272-E/SN MCP6282-E/SN MCP6292-E/P MCP6292-E/SN MCP6294-E/P MCP6442-E/SN MCP6444-E/ST MCP6444-E/SL MCP6H01-E/SN MCP6H02-E/SN MCP6H04-E/ST MCP6H04-E/SL MCP6L01RT-E/OT MCP6L04T-E/SL MCP6V26-E/SN MCP6V27-E/MS MCP6V27-E/SN TC913BCOA SOIC-8 SOIC-8 SOIC-8 SOIC-8 SOIC-8 DFN-8 MSOP-8 DFN-8 MSOP-8 DFN-8 MSOP-8 SOT-23-5 SOT-23-5 SOT-23-5 PDIP-8 PDIP-8 SOIC-8 SOIC-8 MSOP-8 PDIP-14 SOIC-14 PDIP-14 PDIP-8 SOIC-8 PDIP-8 SOIC-8 PDIP-14 SOIC-14 PDIP-8 SOIC-8 SOIC-8 SOIC-8 SOIC-14 PDIP-8 SOT-23-5 MSOP-8 PDIP-8 SOIC-8 PDIP-14 SOIC-14 PDIP-14 SOIC-14 SOIC-8 SOIC-8 SOIC-8 SOIC-14 PDIP-8 SOIC-8 PDIP-14 SOIC-14 PDIP-8 SOIC-8 SOT-23-5 SOIC-8 PDIP-14 SOIC-14 PDIP-8 PDIP-8 SOIC-8 PDIP-8 SOIC-8 PDIP-8 SOIC-8 SOIC-8 DIP-8 SOIC-8 PDIP-14 SOIC-8 TSSOP-14 SOIC-14 SOIC-8 SOIC-8 TSSOP-14 SOIC-14 SOT-23-5 SOIC-14 SOIC-8 MSOP-8 SOIC-8 SOIC-8 Single, 500kHz, 800uA, Rail-to-Rail Input/Output, E Temp Single, 500kHz, 800uA, Rail-to-Rail Input/Output, E Temp Single, 500kHz, 800uA, Rail

les: a) b) Extended temperature, 8LD 4x4 DFN package MCP6V27T-E/MD: Tape and Reel Extended temperature, 8LD 4x4 DFN package c) MCP6V27-E/MS: d) Extended temperature, 8LD MSOP package MCP6V27T-E/MS: Tape and Reel, Extended temperature, 8LD MSOP package. e) MCP6V27-E/SN: = -40C to +125C = Plastic Dual Flat, No-Lead (4x4x0.9 mm), 8-lead = Plastic Micro Small Outline Package, 8-lead = Plastic SOIC (150 mil Body), 8-lead (c) 2011 Microchip Technology Inc. MCP6V27-E/MD: f) Extended temperature, 8LD SOIC package. MCP6V27T-E/SN: Tape and Reel, Extended temperature, 8LD SOIC package. DS25007A-page 43 MCP6V27 NOTES: DS25007A-page 44 (c) 2011 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: * Microchip products meet the specification contained in their particular Microchip Data Sheet. * Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal co

les: a) b) Extended temperature, 8LD 4x4 DFN package MCP6V27T-E/MD: Tape and Reel Extended temperature, 8LD 4x4 DFN package c) MCP6V27-E/MS: d) Extended temperature, 8LD MSOP package MCP6V27T-E/MS: Tape and Reel, Extended temperature, 8LD MSOP package. e) MCP6V27-E/SN: = -40C to +125C = Plastic Dual Flat, No-Lead (4x4x0.9 mm), 8-lead = Plastic Micro Small Outline Package, 8-lead = Plastic SOIC (150 mil Body), 8-lead (c) 2011 Microchip Technology Inc. MCP6V27-E/MD: f) Extended temperature, 8LD SOIC package. MCP6V27T-E/SN: Tape and Reel, Extended temperature, 8LD SOIC package. DS25007A-page 43 MCP6V27 NOTES: DS25007A-page 44 (c) 2011 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: * Microchip products meet the specification contained in their particular Microchip Data Sheet. * Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal co

Op Amp Single Op Amp (Tape and Reel) Dual Op Amp Dual Op Amp (Tape and Reel) Single Op Amp with Chip Select Single Op Amp with Chip Select (Tape and Reel) Examples: a) MCP6V26T-E/MNY: b) MCP6V26-E/MS: a) MCP6V26T-E/SN: a) MCP6V27-E/MD: b) MCP6V27-E/MS: c) MCP6V27-E/SN: a) MCP6V28T-E/MNY: b) MCP6V28-E/MS: c) MCP6V28T-E/SN: = -40C to +125C = = = = Plastic Dual Flat, No-Lead (4x4x0.9), 8-lead Plastic Dual Flat, No-Lead (2x3x0.75), 8-lead Plastic Micro Small Outline Package, 8-lead Plastic SOIC (150mil Body), 8-lead * Y = Nickel Palladium gold manufacturing designator. Only available on the TDFN package. (c) 2011 Microchip Technology Inc. Extended temperature, 8LD 2x3 TDFN package Extended temperature, 8LD MSOP package Tape and Reel, Extended temperature, 8LD SOIC package Extended temperature, 8LD 4x4 DFN package Extended temperature, 8LD MSOP package Extended temperature, 8LD SOIC package Extended temperature, 8LD 2x3 TDFN package Extended temperature, 8LD MSOP package Tape and Reel, Extended temper

Op Amp Single Op Amp (Tape and Reel) Dual Op Amp Dual Op Amp (Tape and Reel) Single Op Amp with Chip Select Single Op Amp with Chip Select (Tape and Reel) Examples: a) MCP6V26T-E/MNY: b) MCP6V26-E/MS: a) MCP6V26T-E/SN: a) MCP6V27-E/MD: b) MCP6V27-E/MS: c) MCP6V27-E/SN: a) MCP6V28T-E/MNY: b) MCP6V28-E/MS: c) MCP6V28T-E/SN: = -40C to +125C = = = = Plastic Dual Flat, No-Lead (4x4x0.9), 8-lead Plastic Dual Flat, No-Lead (2x3x0.75), 8-lead Plastic Micro Small Outline Package, 8-lead Plastic SOIC (150mil Body), 8-lead * Y = Nickel Palladium gold manufacturing designator. Only available on the TDFN package. (c) 2011 Microchip Technology Inc. Extended temperature, 8LD 2x3 TDFN package Extended temperature, 8LD MSOP package Tape and Reel, Extended temperature, 8LD SOIC package Extended temperature, 8LD 4x4 DFN package Extended temperature, 8LD MSOP package Extended temperature, 8LD SOIC package Extended temperature, 8LD 2x3 TDFN package Extended temperature, 8LD MSOP package Tape and Reel, Extended temper