ice Code xx = 1C, 2B, or 2C A = Assembly Location Y = Year WW = Work Week G = Pb-Free Package THERMAL CHARACTERISTICS Thermal Resistance, Junction-to-Ambient COLLECTOR 2,4 ORDERING INFORMATION Device Package Shipping BD241CG TO-220 (Pb-Free) 50 Units/Rail BD242BG TO-220 (Pb-Free) 50 Units/Rail BD242CG TO-220 (Pb-Free) 50 Units/Rail For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. Publication Order Number: BD241C/D BD241C (NPN), BD242B (PNP), BD242C (PNP) ELECTRICAL CHARACTERISTICS (TC = 25C unless otherwise noted) Symbol Characteristic Min Max Unit OFF CHARACTERISTICS VCEO Collector-Emitter Sustaining Voltage (Note 1) (IC = 30 mAdc, IB = 0) BD242B BD241C, BD242C Collector Cutoff Current (VCE = 50 Vdc, IB = 0) (VCE = 60 Vdc, IB = 0) BD242B BD241C, BD242C Collector Cutoff Current (VCE = 80 Vdc, VEB = 0) (VCE = 100 Vdc, VEB = 0) BD242B BD241C, BD242C Vdc 80 100 ICEO mAdc 0.3 mAdc

2 AYWW BD24xxG 3 BD24xx = Device Code xx = 1C, 2B, or 2C A = Assembly Location Y = Year WW = Work Week G = Pb-Free Package THERMAL CHARACTERISTICS Characteristic COLLECTOR 2,4 ORDERING INFORMATION Package Shipping BD241CG TO-220AB (Pb-Free) 50 Units/Rail BD242BG TO-220AB (Pb-Free) 50 Units/Rail BD242CG TO-220AB (Pb-Free) 50 Units/Rail Device For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. Publication Order Number: BD241C/D BD241C (NPN), BD242B (PNP), BD242C (PNP) IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIII IIII IIII III III IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIII

ice Code xx = 1C, 2B, or 2C A = Assembly Location Y = Year WW = Work Week G = Pb-Free Package THERMAL CHARACTERISTICS Thermal Resistance, Junction-to-Ambient COLLECTOR 2,4 ORDERING INFORMATION Device Package Shipping BD241CG TO-220 (Pb-Free) 50 Units/Rail BD242BG TO-220 (Pb-Free) 50 Units/Rail BD242CG TO-220 (Pb-Free) 50 Units/Rail For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. Publication Order Number: BD241C/D BD241C (NPN), BD242B (PNP), BD242C (PNP) ELECTRICAL CHARACTERISTICS (TC = 25C unless otherwise noted) Symbol Characteristic Min Max Unit OFF CHARACTERISTICS VCEO Collector-Emitter Sustaining Voltage (Note 1) (IC = 30 mAdc, IB = 0) BD242B BD241C, BD242C Collector Cutoff Current (VCE = 50 Vdc, IB = 0) (VCE = 60 Vdc, IB = 0) BD242B BD241C, BD242C Collector Cutoff Current (VCE = 80 Vdc, VEB = 0) (VCE = 100 Vdc, VEB = 0) BD242B BD241C, BD242C Vdc 80 100 ICEO mAdc 0.3 mAdc

Package Shipping BD241C TO-220AB 50 Units/Rail BD241CG TO-220AB (Pb-Free) 50 Units/Rail Characteristic Symbol Max Unit Thermal Resistance, Junction-to-Ambient RqJA 62.5 C/W BD242B TO-220AB 50 Units/Rail Thermal Resistance, Junction-to-Case RqJC 3.125 C/W BD242BG TO-220AB (Pb-Free) 50 Units/Rail BD242C TO-220AB 50 Units/Rail BD242CG TO-220AB (Pb-Free) 50 Units/Rail Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. (c) Semiconductor Components Industries, LLC, 2007 November, 2007 - Rev. 7 1 Preferred devices are recommended choices for future use and best overall value. Publication Order Number:

ice Code xx = 1C, 2B, or 2C A = Assembly Location Y = Year WW = Work Week G = Pb-Free Package THERMAL CHARACTERISTICS Thermal Resistance, Junction-to-Ambient COLLECTOR 2,4 ORDERING INFORMATION Device Package Shipping BD241CG TO-220 (Pb-Free) 50 Units/Rail BD242BG TO-220 (Pb-Free) 50 Units/Rail BD242CG TO-220 (Pb-Free) 50 Units/Rail For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. Publication Order Number: BD241C/D BD241C (NPN), BD242B (PNP), BD242C (PNP) ELECTRICAL CHARACTERISTICS (TC = 25C unless otherwise noted) Symbol Characteristic Min Max Unit OFF CHARACTERISTICS VCEO Collector-Emitter Sustaining Voltage (Note 1) (IC = 30 mAdc, IB = 0) BD242B BD241C, BD242C Collector Cutoff Current (VCE = 50 Vdc, IB = 0) (VCE = 60 Vdc, IB = 0) BD242B BD241C, BD242C Collector Cutoff Current (VCE = 80 Vdc, VEB = 0) (VCE = 100 Vdc, VEB = 0) BD242B BD241C, BD242C Vdc 80 100 ICEO mAdc 0.3 mAdc

Package Shipping BD241C TO-220AB 50 Units/Rail BD241CG TO-220AB (Pb-Free) 50 Units/Rail Characteristic Symbol Max Unit Thermal Resistance, Junction-to-Ambient RqJA 62.5 C/W BD242B TO-220AB 50 Units/Rail Thermal Resistance, Junction-to-Case RqJC 3.125 C/W BD242BG TO-220AB (Pb-Free) 50 Units/Rail BD242C TO-220AB 50 Units/Rail BD242CG TO-220AB (Pb-Free) 50 Units/Rail Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. (c) Semiconductor Components Industries, LLC, 2011 October, 2011 - Rev. 8 1 Publication Order Number: BD241C/D BD241C (NPN), BD242B (PNP), BD242C (PNP) IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII

ackage Shipping BD241C TO-220AB 50 Units/Rail BD241CG TO-220AB (Pb-Free) 50 Units/Rail Characteristic Symbol Max Unit Thermal Resistance, Junction-to-Ambient RqJA 62.5 _C/W BD242B TO-220AB 50 Units/Rail Thermal Resistance, Junction-to-Case RqJC 3.125 _C/W BD242BG TO-220AB (Pb-Free) 50 Units/Rail Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. BD242C TO-220AB 50 Units/Rail BD242CG TO-220AB (Pb-Free) 50 Units/Rail *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Preferred devices are recommended choices for future use and best overall value. (c) Semiconductor Components Industries, LLC, 2005