EGP20G www.vishay.com Vishay General Semiconductor Glass Passivated Ultrafast Plastic Rectifier FEATURES * Superectifier structure for high reliability condition SUPERECTIFIER * Cavity-free glass-passivated junction (R) * Ultrafast reverse recovery time * Low forward voltage drop * Low leakage current * Low switching losses, high efficiency * High forward surge capability DO-204AC (DO-15) * Solder dip 275 C max. 10 s, per JESD 22-B106 * Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 TYPICAL APPLICATIONS For use in high frequency rectification and freewheeling application in switching mode converters and inverters for consumer, computer and telecommunication. PRIMARY CHARACTERISTICS IF(AV) 2.0 A VRRM 50 V, 100 V, 150 V, 200 V, 300 V, 400 V IFSM 75 A MECHANICAL DATA trr 50 ns VF 0.95 V, 1.25 V Case: DO-204AC, molded epoxy over glass body Molding compound meets UL 94 V-0 flammability rating Base P/N-E3 - RoHS-compliant, commercial grade TJ max. 150 C Packa
Semiconductor 1N6301A 1N6302 1N6302 1N6302A 1N6302A 1N6302A 1N6302A 1N6302A 1N6302A 1N6303 1N6303 1N6303A 1N6303A 1N6303A 1N6303A 1N6303A 1N6303A 1.5KE10A 1.5KE13 1.5KE15A 1.5KE20 1.5KE24 1.5KE10CA 1.5KE13C 1.5KE15CA 1.5KE20C 1.5KE24C BYV26E GP15B EGP20D EGP20G EGP20G GP15G EGP20J GP15J RGP15MT FUF2007 FUF2007 GP15M EGP20D GP15M 1N4937GP GP15B GP15G GP15G GP15J GP15J P6SMB120A P6SMB12A P6SMB12CA P6SMB130A P6SMB13A P6SMB13CA 1SMB120A 1SMB12A 1SMB12CA 1SMB130A 1SMB13A 1SMB13CA 1SMB14A 1SMB14CA 1SMB150A 1SMB15A 1SMB15CA 1SMB160A 1SMB16A 1SMB16CA 1SMB170A 1SMB17A 1SMB17CA 1SMB18A 1SMB18CA 1SMB20A 1SMB20CA 1SMB22A 1SMB22CA 1SMB24A 1SMB24CA 1SMB26A 1SMB26CA 1SMB28A 1SMB28CA 1SMB30A 1SMB30CA 1SMB33A 1SMB33CA 1SMB36A 1SMB36CA 1SMB40A 1SMB40CA 1SMB43A 1SMB43CA 1SMB45A 1SMB45CA 1SMB48A 1SMB48CA 1SMB5.0A 1SMB51A 1SMB51CA 1SMB54A 1SMB54CA 1SMB58A 1SMB58CA 1SMB5921B 1SMB5922B 1SMB5923B ON Semiconductor ON Semiconductor ON Semiconductor ON Semiconductor ON Semiconductor ON Semiconductor ON Semico
EGP20G www.vishay.com Vishay General Semiconductor Glass Passivated Ultrafast Plastic Rectifier FEATURES * Superectifier structure for high reliability condition SUPERECTIFIER * Cavity-free glass-passivated junction (R) * Ultrafast reverse recovery time * Low forward voltage drop * Low leakage current * Low switching losses, high efficiency * High forward surge capability DO-204AC (DO-15) * Solder dip 275 C max. 10 s, per JESD 22-B106 * Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 TYPICAL APPLICATIONS For use in high frequency rectification and freewheeling application in switching mode converters and inverters for consumer, computer and telecommunication. PRIMARY CHARACTERISTICS IF(AV) 2.0 A VRRM 50 V, 100 V, 150 V, 200 V, 300 V, 400 V IFSM 75 A MECHANICAL DATA trr 50 ns VF 0.95 V, 1.25 V Case: DO-204AC, molded epoxy over glass body Molding compound meets UL 94 V-0 flammability rating Base P/N-E3 - RoHS-compliant, commercial grade TJ max. 150 C Packa
EGP20G Vishay General Semiconductor Glass Passivated Ultrafast Rectifier (R) Major Ratings and Characteristics IF(AV) 2.0 A VRRM 50 V to 400 V IFSM 75 A trr 50 ns VF 0.95 V, 1.25 V Tj max. 150 C d* e t n Pate DO-204AC (DO-15) * Glass Encapsulation technique is covered by Patent No. 3,996,602, brazed-lead assembly to Patent No. 3,930,306 Features Mechanical Data * * * * * * * Case: DO-204AC, molded epoxy over glass body Epoxy meets UL-94V-0 Flammability rating Terminals: Matte tin plated leads, solderable per J-STD-002B and JESD22-B102D E3 suffix for commercial grade, HE3 suffix for high reliability grade (AEC Q101 qualified) Polarity: Color band denotes cathode end Cavity-free glass-passivated junction Ultrafast reverse recovery time Low forward voltage drop Low leakage current Low switching losses, high efficiency High forward surge capability Solder Dip 260 C, 40 seconds Typical Applications For use in high frequency rectification and freewheeling application in switching mode converters and in
..................................... EGL34A thru EGL34G.................................................. EGL41A thru EGL41G.................................................. EGP10A thru EGP10G................................................. EGP20A thru EGP20G................................................. EGP30A thru EGP30G................................................. EGP50A thru EGP50G................................................. ES1A thru ES1D........................................................... ES1PB, ES1PC & ES1PD............................................ ES2A thru ES2D........................................................... ES2F & ES2G .............................................................. ES3A thru ES3D........................................................... ES3F & ES3G .............................................................. ESH1B, ESH1C & ESH1D ........................................... ESH1PB, ESH1PC & ESH1PD ....................................
EGP20G Vishay General Semiconductor Glass Passivated Ultrafast Rectifier FEATURES (R) * Cavity-free glass-passivated junction * Ultrafast reverse recovery time * Low forward voltage drop * Low leakage current d* e t n e Pat * Low switching losses, high efficiency * High forward surge capability DO-204AC (DO-15) * Glass Encapsulation technique is covered by Patent No. 3,996,602, brazed-lead assembly to Patent No. 3,930,306 * Solder dip 260 C, 40 s * Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC TYPICAL APPLICATIONS For use in high frequency rectification and freewheeling application in switching mode converters and inverters for consumer, computer and telecommunication. PRIMARY CHARACTERISTICS IF(AV) 2.0 A VRRM 50 V to 400 V IFSM 75 A trr 50 ns VF 0.95 V, 1.25 V TJ max. 150 C MECHANICAL DATA Case: DO-204AC, molded epoxy over glass body Epoxy meets UL 94V-0 flammability rating Terminals: Matte tin plated leads, solderable per J-STD-002 and JESD22-B102 E3 suffix for consumer grade,
EGP20G Vishay General Semiconductor Glass Passivated Ultrafast Rectifier (R) Major Ratings and Characteristics IF(AV) 2.0 A VRRM 50 V to 400 V IFSM 75 A trr 50 ns VF 0.95 V, 1.25 V Tj max. 150 C d* e t n Pate DO-204AC (DO-15) * Glass Encapsulation technique is covered by Patent No. 3,996,602, brazed-lead assembly to Patent No. 3,930,306 Features Mechanical Data * * * * * * * Case: DO-204AC, molded epoxy over glass body Epoxy meets UL-94V-0 Flammability rating Terminals: Matte tin plated leads, solderable per J-STD-002B and JESD22-B102D E3 suffix for commercial grade, HE3 suffix for high reliability grade (AEC Q101 qualified) Polarity: Color band denotes cathode end Cavity-free glass-passivated junction Ultrafast reverse recovery time Low forward voltage drop Low leakage current Low switching losses, high efficiency High forward surge capability Solder Dip 260 C, 40 seconds Typical Applications For use in high frequency rectification and freewheeling application in switching mode converters and in
EGP20G(Z) VOLTAGE RANGE: 50 --- 400 V CURRENT: 2.0 A FEATURES DO - 15 Low cost Diffused junction Low leakage Low forward voltage drop High current capability Easily cleaned with Alcohol,Isopropanol and similar solvents The plastic material carries U/L recognition 94V-0 MECHANICAL DATA Case:JEDEC DO--15,molded plastic Terminals: Axial lead ,solderable per MIL- STD-750,Method 2026 Polarity: Color band denotes cathode Weight: 0.014 ounces,0.39 grams Mounting position: Any MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Ratings at 25 ambient temperature unless otherwise specified. Single phase,half wave,60 Hz,resistive or inductive load. For capacitive load,derate by 20%. Maximum recurrent peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum average forw ard rectified current 9.5mm lead length, @TA =75 EGP 20A EGP 20B EGP 20C EGP 20D EGP 20F EGP 20G UNITS 50 35 50 100 150 200 300 70 100 105 150 140 200 210 300 400 280 400 V V V VRRM VRMS VDC IF(AV) 2.0 A IFSM 75.0 A Peak forw a
EGP20G Vishay General Semiconductor Glass Passivated Ultrafast Rectifier FEATURES (R) * Cavity-free glass-passivated junction * Ultrafast reverse recovery time * Low forward voltage drop * Low leakage current d* e t n e Pat * Low switching losses, high efficiency * High forward surge capability DO-204AC (DO-15) * Glass Encapsulation technique is covered by Patent No. 3,996,602, brazed-lead assembly to Patent No. 3,930,306 * Solder dip 260 C, 40 s * Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC TYPICAL APPLICATIONS For use in high frequency rectification and freewheeling application in switching mode converters and inverters for consumer, computer and telecommunication. PRIMARY CHARACTERISTICS IF(AV) 2.0 A VRRM 50 V to 400 V IFSM 75 A trr 50 ns VF 0.95 V, 1.25 V TJ max. 150 C MECHANICAL DATA Case: DO-204AC, molded epoxy over glass body Epoxy meets UL 94V-0 flammability rating Terminals: Matte tin plated leads, solderable per J-STD-002 and JESD22-B102 E3 suffix for consumer grade,
ILIPS PHILIPS PHILIPS TFK TFK TFK TFK TFK RGP08G RGP08J RGP08MT RGP08MT RGP10D RGP10G RGP10J RGP10MT RGP10MT FRS1D FRS1G FRS1J FRS1K FRS1M FES1D FES1G FES26C RGP10G EGP08A EGP08B EGP08D EGP08D EGP08F EGP08F EGP08G EGP20A EGP20B EGP20D EGP20D EGP20F EGP20F EGP20G EGP20A EGP20B EGP20D EGP20D EGP20F EGP20F EGP20G FES1A FES1B FES1D FES1D FES1F FES1F FES1G FS1G FS1G FS1J FS1K FS1M BYG20D BYG20G BYG20J BYG21K BYG21M BYG22A BYG22B BYG22D BYG50D BYG50G BYG50J BYG50K BYG50M BYG60D BYG60G BYG60J BYG60K BYG60M BYG70D BYG70G BYG70J BYG80A BYG80B BYG80C BYG80D BYG80E BYG80F BYG80G BYG80J BYG90-20 BYG90-30 BYG90-40 BYM10-100 BYM10-1000 BYM10-200 BYM10-400 BYM10-50 BYM10-600 BYM10-800 BYM11-100 BYM11-1000 BYM11-200 BYM11-400 BYM11-50 BYM11-600 BYM11-800 BYM12-100 BYM12-150 BYM12-200 BYM12-300 BYM12-400 TFK TFK TFK TFK TFK TFK TFK TFK PHILIPS PHILIPS PHILIPS PHILIPS PHILIPS PHILIPS PHILIPS PHILIPS PHILIPS PHILIPS PHILIPS PHILIPS PHILIPS PHILIPS PHILIPS PHILIPS PHILIPS PHILIPS PHILIPS PHILIPS PHILIPS
6280A MICR/MOTO 1N6280A, 1N6482 Gl FSI 1N6281 MICR/MOTO IN6281A 1N6483 GL. FSIK iN6281A MICR/MOTO IN6281A IN6484 GI. FSIM IN6282 MICR/MOTO IN6282A iNU41 TOSHIBA BYV26E IN6282A MICRMOTO 1N6282A 1RSBZ41 TOSHIBA GPISB 1N6283 MICR/MCTO 1N6283A IRSGH48 TOSHIBA EGP20G ING283A MICR/MOTO IN6283A IRSGU41 TOSHIBA EGP20D 1N6284 MICRIMOTO IN6284A 1R5GZ41 TOSHIBA GP15G 399Competitor FAGOR Competitor FAGOR Part Number Competitor Part Number Part Number Competitor Part Number IRSJUE1 TOSHIBA BYM26C ISMB33AT3 MOTOROLA PESMB39A, IR5]Z41 TOSHIBA GP1S5] ISMB33CAT3 MOTOROLA P6SMB39CA IRSNU41 TOSHIBA BYV26E ISMB36AT3 MOTOROLA P6SMB43A, IR5NZ41 TOSHIBA GPI5M ISMB36CAT3 MOTOROLA P6SMB43CA IRDSDL41A TOSHIBA EGP20D ISMB40AT3 MOTOROLA POSMB47A 181830 TOSHIBA GP15M ISMB40CAT3 MOTOROLA P6SMB47CA 181834 TOSHIBA RGP1OG ISMB43AT3 MOTOROLA. P6SMBS1A 181835 TOSHIBA RGP10] ISMB43CAT3 MOTOROLA. P6SMBS1CA 1S1885A TOSHIBA GP15B ISMB45AT3 MOTOROLA P6SMB5S6A, 181886 TOSHIBA GP1SB LSMB4SCAT3 MOTOROLA, PBSMBSECA 1$]887 TOSHIBA GP15G ISM
R522 47 3W :FPRD H.DY(+) C554 0.0047 2kV C513 0.051 400V :PP R513 JW(7.5) FB501 1.1UH C522 1 12V B16 C527 680p 2kV B R511 68 2W :FPRD +12V CN101 B18 :B 6 C505 470p 500V B C504 470p 500V B C511 0.022 2kV :PP R512 47 3W :FPRD 7 1 T504 DF TRANSFORMER 2 D531 EGP20G +12V.RECT C539 470 25V C551 0.47 160V C550 * 2 B+ +12V R541 * 3 6 8 4 D502 ERC06-15S DAMPER C509 680p 2kV B Q502 2SD2580-CA H-OUT 5 TP98 R526 JW 7.5MM D1302 1SS133T-77 OR B30 Y B19 4 3 R502 4.7k :CHIP C503 470p CH:CHIP D1304 1SS133T-77 OR R1362 470k :CHIP C507 680p 2kV 1 R503 4.7k :FPRD Q1353 2SA1162 INV C374 0.1 25V B:CHIP TO AX BOARD B24 +B R1317 220k :CHIP T501 :HDT C506 0.047 200V :PT Q501 2SC3209-LK H-DRIVE 9V 18 C508 470p 500V 16 R501 470 :CHIP D1301 MA111-TX R1315 100 :CHIP SCL 14 OSC AFA 12V YOUT 4 15 C502 0.47 +B C1369 0.1 25V B:CHIP 9V 9V DVD Y DVD R-Y 21 3 16 C1371 0.0047 B:CHIP R1364 100k :CHIP A DVD B-Y TVIN B23 2 17 DCTRAN R1314 1k :RN-CP 1 18 ABLIN GND P B-Y YUVSW CLAMP 2 P R-Y LEVEL YOUT 3 IC353 TA1226N SHP R1319 0.68 1/2W
EGP20G www.vishay.com Vishay General Semiconductor Glass Passivated Ultrafast Plastic Rectifier FEATURES * Superectifier structure for high reliability condition SUPERECTIFIER * Cavity-free glass-passivated junction (R) * Ultrafast reverse recovery time * Low forward voltage drop * Low leakage current * Low switching losses, high efficiency * High forward surge capability DO-204AC (DO-15) * Solder dip 275 C max. 10 s, per JESD 22-B106 * Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 TYPICAL APPLICATIONS For use in high frequency rectification and freewheeling application in switching mode converters and inverters for consumer, computer and telecommunication. PRIMARY CHARACTERISTICS IF(AV) 2.0 A VRRM 50 V, 100 V, 150 V, 200 V, 300 V, 400 V IFSM 75 A MECHANICAL DATA trr 50 ns VF 0.95 V, 1.25 V Case: DO-204AC, molded epoxy over glass body Molding compound meets UL 94 V-0 flammability rating Base P/N-E3 - RoHS-compliant, commercial grade TJ max. 150 C Packa
EGP20G Vishay General Semiconductor Glass Passivated Ultrafast Rectifier FEATURES * Superectifier structure for high reliability condition SUPERECTIFIER * Cavity-free glass-passivated junction (R) * Ultrafast reverse recovery time * Low forward voltage drop * Low leakage current * Low switching losses, high efficiency * High forward surge capability DO-204AC (DO-15) * Solder dip 275 C max. 10 s, per JESD 22-B106 * AEC-Q101 qualified * Compliant to RoHS Directive 2002/95/EC and in accordance to WEEE 2002/96/EC TYPICAL APPLICATIONS For use in high frequency rectification and freewheeling application in switching mode converters and inverters for consumer, computer and telecommunication. PRIMARY CHARACTERISTICS IF(AV) 2.0 A VRRM 50 V to 400 V IFSM 75 A trr 50 ns VF 0.95 V, 1.25 V TJ max. 150 C MECHANICAL DATA Case: DO-204AC, molded epoxy over glass body Molding compound meets UL 94 V-0 flammability rating Base P/N-E3 - RoHS compliant, commercial grade Base P/NHE3 - RoHS compliant, AEC-Q101 qualified
EGP20G Vishay Semiconductors Glass Passivated Ultrafast Rectifier (R) Major Ratings and Characteristics IF(AV) 2.0 A VRRM 50 V to 400 V IFSM 75 A trr 50 ns VF 0.95 V, 1.25 V Tj max. 150 C d* e t n Pate DO-204AC (DO-15) * Glass Encapsulation technique is covered by Patent No. 3,996,602, brazed-lead assembly to Patent No. 3,930,306 Features Mechanical Data * * * * * * * Case: DO-204AC, molded epoxy over glass body Epoxy meets UL-94V-0 Flammability rating Terminals: Matte tin plated leads, solderable per J-STD-002B and JESD22-B102D E3 suffix for commercial grade, HE3 suffix for high reliability grade (AEC Q101 qualified) Polarity: Color band denotes cathode end Cavity-free glass-passivated junction Ultrafast reverse recovery time Low forward voltage drop Low leakage current Low switching losses, high efficiency High forward surge capability Solder Dip 260 C, 40 seconds Typical Applications For use in high frequency rectification and freewheeling application in switching mode converters and inverters