5962-9559508H9X
128K X 32 MULTI DEVICE SRAM MODULE, 25 ns, CQFP68

From Microsemi Corp.

StatusACTIVE
Access Time-Max (tACC)25 ns
Alternate Memory Width16
Memory Density4.19E6 deg
Memory IC TypeMULTI DEVICE SRAM MODULE
Memory Width32
Mfr Package Description23.90 MM, 3.57 MM HEIGHT, CERAMIC, QFP-68
Number of Functions1
Number of Terminals68
Number of Words131072 words
Number of Words Code128K
Operating ModeASYNCHRONOUS
Operating Temperature-Max125 Cel
Operating Temperature-Min-55 Cel
Organization128K X 32
Package Body MaterialCERAMIC, METAL-SEALED COFIRED
Package ShapeSQUARE
Package StyleFLATPACK
Parallel/SerialPARALLEL
Supply Voltage-Max (Vsup)5.5 V
Supply Voltage-Min (Vsup)4.5 V
Supply Voltage-Nom (Vsup)5 V
Surface MountYes
TechnologyCMOS
Temperature GradeMILITARY
Terminal FinishGOLD
Terminal FormGULL WING
Terminal PositionQUAD

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